第三代
半導(dǎo)體測(cè)試家族
Third generation semiconductor testing family
分類
QP3000
Suitable for automatic probe testing of wafers such as 8 and 12″ Si and SiC discrete devices, power devices, integrated circuits, radio frequency devices, optical chips, etc. Automatic loading and unloading, Wafer ID reading. Fully automatic CCD visual needle positioning. High precision positioning platform. Support high temperature testing. Real time generation of Mapping display Bin. Universal GPIB, TTL, R-232 interfaces.
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Suspended power supply |
Multiple sites in parallel |
Multi-channel high precision |
Supports multiple extensions |
| Model | QP3000 |
| Product introduction |
Suitable for automatic probe testing of wafers such as 8 and 12″ Si and SiC discrete devices, power devices, integrated circuits, radio frequency devices, optical chips, etc.
Automatic loading and unloading, Wafer ID reading. |
| Features |
? Fully automatic CCD visual needle positioning. ? High-precision positioning platform. ? Support normal high temperature testing. ? Generate Mapping display Bin in real time. ? Universal GPIB, TTL, R-232 interface. |
Recommend推薦產(chǎn)品
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中國(guó)廣東省佛山市南海國(guó)家高新區(qū)新光源產(chǎn)業(yè)基地光明大道16號(hào) |
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0757 83207313 (銷售) |
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0757 83208786 (銷售) |
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info@powertechsemi.com |
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